ARM  Ltd., the 
ARM  (LSE: ARM, NASDAQ: ARMH) and Taiwan Semiconductor Manufacturing Co. (NYSE: TSM)  announced a multiyear agreement this week to collaborate on leading-edge  7-nanometer FinFET process technology. (FinFET stands for fin-shaped  field-effect transistor, an emerging process technology that reduces leakage  current in systems-on-chip, or SoCs.)
The  partners said the deal extends their existing partnership to push the latest  device process technology into datacenters and next-generation networks. It  also builds on previous collaboration on earlier generations of FinFET process  technology used in ARM’s chip intellectual property offerings.
Chip  scaling is advancing in parallel with hyper-convergence  in datacenters. ARM is attempting to make inroads in datacenters dominated by  x86-based infrastructure through what it claims are up to 10-fold increases in  compute density for specific datacenter workloads. The deal with TSMC enables the  chip vendor to design processors aimed datacenters and network infrastructure  that are optimized for the 
The  scaling of chip component densities translates to higher compute density across  IT infrastructure while reducing power consumption, the partners claimed.
For  TSMC, 
TSMC  said high-performance computing SoCs based on its latest chip processing  technology would boost performance without a power penalty while reducing power  consumption at the 10-nanometer FinFET process node.
ARM  and TSMC have collaborated on previous generations of FinFET process  technology. ARM’s Cortex-A72 processor is based on TSMC’s 16- and  10-nanometer FinFET process nodes.
ARM  cores have slowly made their way into server SoCs. Late last year it announced  new math libraries running on its 64-bit processors aimed at HPC servers.  “The HPC community are early adopters of ARM-based servers and the  introduction of optimized math routines build a foundation for enabling  scientific computing on 64-bit ARM based compute platforms,” the chip  designer noted in statement releasing the libraries.
ARM  also announced a partnership with chip networking specialist Cavium (NASDAQ:  CAVM) to develop HPC and big data analytics software running on its ARM-based  processing platform.
Meanwhile,  semiconductor foundries like TSMC have been steadily moving down the  chip-scaling curve from 16- to 10- to 7-nanometer designs based on lower power  FinFET process technology. TSMC said in January it expects to begin production  at the 7-nanometer node in 2017.
ARM  Ltd., the 
ARM  (LSE: ARM, NASDAQ: ARMH) and Taiwan Semiconductor Manufacturing Co. (NYSE: TSM)  announced a multiyear agreement this week to collaborate on leading-edge  7-nanometer FinFET process technology. (FinFET stands for fin-shaped  field-effect transistor, an emerging process technology that reduces leakage  current in systems-on-chip, or SoCs.)
The  partners said the deal extends their existing partnership to push the latest  device process technology into datacenters and next-generation networks. It  also builds on previous collaboration on earlier generations of FinFET process  technology used in ARM’s chip intellectual property offerings.
Chip  scaling is advancing in parallel with hyper-convergence in datacenters. ARM is  attempting to make inroads in datacenters dominated by x86-based infrastructure  through what it claims are up to 10-fold increases in compute density for  specific datacenter workloads. The deal with TSMC enables the chip vendor to  design processors aimed datacenters and network infrastructure that are  optimized for the 
The  scaling of chip component densities translates to higher compute density across  IT infrastructure while reducing power consumption, the partners claimed.
For  TSMC, 
TSMC  said high-performance computing SoCs based on its latest chip processing  technology would boost performance without a power penalty while reducing power  consumption at the 10-nanometer FinFET process node.
ARM  and TSMC have collaborated on previous generations of FinFET process  technology. ARM’s Cortex-A72 processor is based on TSMC’s 16- and  10-nanometer FinFET process nodes.
ARM  cores have slowly made their way into server SoCs. Late last year it announced  new math libraries running on its 64-bit processors aimed at HPC servers.  “The HPC community are early adopters of ARM-based servers and the  introduction of optimized math routines build a foundation for enabling  scientific computing on 64-bit ARM based compute platforms,” the chip  designer noted in statement releasing the libraries.
ARM  also announced a partnership with chip networking specialist Cavium (NASDAQ:  CAVM) to develop HPC and big data analytics software running on its ARM-based  processing platform.
Meanwhile,  semiconductor foundries like TSMC have been steadily moving down the chip-scaling  curve from 16- to 10- to 7-nanometer designs based on lower power FinFET  process technology. TSMC said in January it expects to begin production at the  7-nanometer node in 2017.
